| 摘要 |
<p>Repair lines in an imager device include protective layers disposed over steps in the repair lines where the repair lines extend over underlying components in the imager array. The protective layers each include a layer of polyimide to provide protection for the step portions of the conductive repair line from etchants and the like to which the conductive line is exposed during fabrication processes for the imager array. The protective layers are disposed over the steps of a conductive line in a repair crossover region so as to provide a repair area free from the protective material of the protective layers disposed thereon in the repair crossover region where the conductive repair line is disposed in vertical alignment with an underlying address line.</p> |
