发明名称 CARRYING-IN AND CARRYING-OUT DEVICE HAVING TWO-LAYER TABLE
摘要 <p>PURPOSE:To shorten cycle time and improve working efficiency by situating an upper table for placing a treated workpiece in a retreated position when the workpiece on a lower table is carried. CONSTITUTION:The frame of a wafer W1 treated by a dividing means is stucked by a carrying means, carried to a prescribed position on an upper table 11a, and received thereby. The wafer W1 received by the upper table 11a is slid on the upper table 1a while the frame is pressed by a pressing plate by advancing a carrying-in device, and housed in an original position in a cassette. After the wafer W1 is housed, a lower table 11b is laid in the state where a wafer W2 is waited thereon. The upper table 11a is opened just after it, and situated in a retreated position, the frame of the wafer W2 is socked and lifted by the carrying means, and an arm is rotated to carry the wafer to the dividing means.</p>
申请公布号 JPH07164273(A) 申请公布日期 1995.06.27
申请号 JP19930342775 申请日期 1993.12.16
申请人 DEISUKO ENG SERVICE:KK 发明人 TAKEZAWA SUSUMU
分类号 B23Q7/04;B65G1/00;B65G1/06;H01L21/301;H01L21/677;H01L21/68;(IPC1-7):B23Q7/04 主分类号 B23Q7/04
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