| 摘要 |
PURPOSE:To provide a fault inspection method for a semiconductor element, in which a fault signal can be extracted easily and surely. CONSTITUTION:In the fault inspection method, arrangement information on element regions 2 and pad regions 3 inside the face of a semiconductor element 1 is stored in advance, the image of the semiconductor element 1 is fetched, the image is then divided for every element region 2 and the pad region 3 on the basis of the arrangement information which has been stored, individual signals are processed for divided images, and signals of faults 10 are extracted respectively. In addition, also in the fault inspection method, the signals of the faults 10 are extracted for the divided images, and only the signals of the individual faults 10 are displayed so as to correspond to arrangements of the element regions 2 and the pad regions 3. |
