| 摘要 |
<p>PURPOSE:To easily change the function of a lead terminal by a method wherein a plurality of rows of pads, having the same function and arranged in a row, are formed by function almost in the center part of a semiconductor chip, and a lead terminal is connected to one place of the pads of the same function through the intermediary of a wire. CONSTITUTION:The bonding pads 3, formed on the surface of a semiconductor chip 2 which is formed by dicing a water through various processes, and lead terminals 4 are connected in a semiconductor device 1, and the semiconductor chip 2 is encapsulated with molding resin 6 in such a manner that a part of the lead terminals 4 are led out to outside. The bonding pads 3 are formed in such a manner that they are concentrated in the center part of the surface of the semiconductor chip 2. The bonding pads 3, which have the same function, are formed, and the function of each lead terminal 4 can be changed by altering the combination of the connection of the lead terminals 4. As a result, diversified specifications can be adopted in a flexibly manner.</p> |
