| 摘要 |
PURPOSE:To provide a semiconductor device excellent in airtightness, where the adhesive strength between a semiconductor chip and a container increases and also the property deterioration of the chip lessens, too, and its manufacture. CONSTITUTION:This posses a stage 4, a package which has a ventilation structure 7 provided correspondingly to this place 4, a thermosetting adhesive layer 8, an IC chip 3 and a cover 10, which seals the ventilation structure 7. By this structure, the adhesive layer 8 can be attracted through the ventilation structure 7 by providing the ventilation structure 7. By this attraction, bubbles can be removed from inside the adhesive layer 8. Therefore, the adhesive strength between a chip 3 and a package 1 improves. Moreover, the property deterioration of the chip 3 caused by stress damage do not occur, too. The damage of the package 1 decreases, too. Furthermore, the airtightness can be preserved favorably even after completion of the device by providing a cover 10 for sealing the ventilation structure 7. |
