| 摘要 |
<p>PURPOSE:To accurately keep a dielectric constant regardless of the resin content by adopting a resin composition that is made of a thermosetting resin mixed with a filler for correcting dielectric constant. CONSTITUTION:A conductive layer is provided on at least one side of an insulation layer. A fiber material is essentially composed, as an insulation layer, of a thermosetting resin and a filler for correcting dielectric constant. A prepreg is coated and impregnated with a resin composition that is adjusted so as to exhibit the same dielectric constant as that of the fiber material and dired. The prepreg is heated and pressed to fabricate the board. An epoxy resin, polyimide resin, ciano ester resin, or their deformed resin, etc., is used for a thermosetting resin, for example. In addition, the filler for correcting dielectric constant is mixed to a thermosetting resin to match the dielectric constant with that of a cured matrix resin.</p> |
