| 摘要 |
<p>PURPOSE:To prevent resin from flowing out without using tie blocks in manufacture of a resin molded semiconductor device. CONSTITUTION:Concerning to a resin molded tie-blockless lead frame 1, the dimension of the lead spaces in resin flowing-out preventing lead 3a parts to be clamped by a molding die is 30mum or so. A polyimide tape 4 etc., for preventing the deformation of leads 3 are applied in the breadth direction of the leads 3, to the insides of the resin flowing-out preventing leads 3a. If the resin flowing-out preventing lead 3a parts are clamped by the molding die, the gaps between the molding die and the resin flowing-out preventing leads 3a become 30mum or so, and the spaces between the resin flowing-out preventing leads 3a are stuffed by a filler having an average diameter of 50mum or so, and flowing out of the resin is prevented.</p> |
