| 摘要 |
PURPOSE:To mount a package onto a circuit board and take out of it simply and reliably without requiring soldering by fixing the package body to the circuit body through a fixing means, and maintaining the contact condition between the pin terminals and connection pads. CONSTITUTION:A package body 6 molds a semiconductor chip 4, and it consists of a nonconductive material having many pin holes 11. Moreover, many conductive pin terminals 16 are electrically connected with the semiconductor chip 4, accommodated in the pin hole 11 of the package body 6, and opposed to the connection pads 21 on this circuit board 2 when the package body 6 is mounted on the circuit board 2. What is more, a compressive coil spring 19 energizes many pin terminals 16 in the direction in which they project from the package body 6. Furthermore, the package body 6 is fixed releasably to the circuit board 2 by a bolt 24 and a nut 26, thus the contact condition between the pin terminals 16 and the connection pads 21 is maintained. Hereby, high- density mounting can be materialized. |
