发明名称
摘要 <p>PURPOSE:To enable the cutting off and modification of inner wiring of the multilayer printed wiring board having a non-penetrated through hole to be performed easily. CONSTITUTION:Within the multilayer printed wiring board having non-penetrated through hole 5b, an inner layer land 11b is provided on the specific position of an inner layer wiring 6a and then led out onto the surface layer through the intermediary of the non-penetrated through hole 5b to be connected to a surface land 4. This surface land 4 independently provided is not connected to any other land, pad and wiring at all on the surface layer. Furthermore, the central part of this surface land 4 has a round or ring shape so as to be easily recognized.</p>
申请公布号 JPH0758834(B2) 申请公布日期 1995.06.21
申请号 JP19920319553 申请日期 1992.11.30
申请人 发明人
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址