| 摘要 |
A plating apparatus for plating a substrate comprises a processing section (12) defined in a clean room, processing units (5, 6) disposed within the processing section (12) for processing the substrate, a plating section (14) defined in the processing section (12), and a plating unit (4) disposed within the plating section (14) for plating the substrate (W). Air can be supplied to and discharged from the plating section (14) independently of the processing section (12) outside of the plating section (14). The plating apparatus further comprises a partition wall (10) for isolating the plating section (14) from the processing section (12), and at least one opening defined in the partition wall (10) for transferring the substrate (W) between the plating section (14) and the processing section (12). |
