发明名称 GATE SEPARATING DEVICE FOR RESIN SEALING SEMICONDUCTOR DEVICE
摘要 PURPOSE:To separate a gate from a lead frame assuredly even when a highly adhesive resin is used as a sealing resin. CONSTITUTION:On a runner supporting plate 1, a lower plate 3 on which a molded piece 20 is to be placed with a direction where a runner makes a bottom face of a lead frame 22 is rotatably arranged, and a runner pressing plate 10 which is slantingly supported by a joint plate 6 through a universal joint 14 in an optional direction and pinches the runner of the molded piece 20 between the runner supporting plate 1 is arranged opposingly. At the runner pressing plate 10, an upper plate 9 for pinching the lead frame 22 of the molded piece 20 between the lower plate 3 is rotatably provided. The joint plate 6 is made to descend by a descending cylinder 7 and the runner pressing plate 10 and the upper plate 9 descend accordingly, so that the runner of the molded piece 20 and the lead frame 22 are pinched by nearly uniform pressing force. In this state, the lower plate 3 is pushed up by a push-up cylinder 4, so that a gate is separated from the lead frame 22.
申请公布号 JPH07156215(A) 申请公布日期 1995.06.20
申请号 JP19930310235 申请日期 1993.12.10
申请人 NEC CORP 发明人 FUJIWARA TOSHIKATSU
分类号 B29C45/38;B29L31/34;H01L21/56;(IPC1-7):B29C45/38 主分类号 B29C45/38
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