| 摘要 |
PURPOSE: To easily and efficiently mount an optoelectronic interface on a connection substrate by molding and connecting a flexible circuit film provided with plural electric traces along with an optical part inside a void part in a mold. CONSTITUTION: The flexible circuit film 103 having plural electric traces 118 is provided. Also, the mold 102 having a void part 112 capable of receiving the flexible circuit film 103 is provided and the flexible circuit film 103 is arranged inside the mold 102. A first optical part is molded with the flexible circuit film 103 inside the void part 112 of the mold 102 and the flexible circuit film 103 is connected to the first optical part. Thus, the optoelectronic interface is easily and efficiently surface-mounted to a mutual connection substrate. Also, the manual steps of a high cost are omitted, the manufacturing steps are automated and optoelectronic parts are integrated to standard electronic parts by a highly cost effective method. |
