| 摘要 |
PURPOSE:To realize high density wiring by providing a thin conductor film for connecting a signal between layers even at the parts other than a through hole on a printed board thereby decreasing the number of through holes of the printed board. CONSTITUTION:In a printed board 1, the wiring pattern 2 for connecting the signal line between layers is led out to the outer periphery of the printed board 1. A conductor thin film 3 is superposed on the wiring pattern 2 when the printed boards 1 are stuck together thus ensuring conduction of signal line between the layers. This structure decreases the number of through holes in the printed board thus realizing high density wiring. |
