| 摘要 |
PURPOSE:To provide a power semiconductor device in which a molded IC can be mounted integrally without resin-molding a connector member in advance. CONSTITUTION:In an actuator, a signal from a molded IC 3 to be used as an ECU which has been formed as an IC is received, and a motor 8 inside is driven. In the actuator, a molded-IC internal-installation part 7 and a connector part 2 are formed in a case 1 for the actuator, and the molded IC is arranged and installed. The molded IC 3 and the motor 8 are connected by a wiring 6 at the inside of the case 1 for the actuator. |
