| 摘要 |
An electro-mechanical assembly includes a high power IC package and a low power IC package which are mounted with a space between them on a single substrate. Both of these IC packages have flat top surfaces which dissipate heat; and due to various manufacturing tolerances, those surfaces are non-coplanar with respect to each other. To cool these two IC packages, a single heat sink is provided which has a thin flat core that overlies both of the IC packages as well as the space between them, and cooling fins extend from the top of the core. A pair of contact regions are provided on the bottom of the core which respectively are supported by the flat surfaces of the IC packages; and the contact region for the high power IC package is a projection from the core which is a) substantially smaller in average cross-sectional area, parallel to the core, than the flat surface of the high power IC package, b) aligned with a high power chip in the high power IC package, and c) long enough to prevent any portion of the core from touching the flat surface of the high power IC package, despite its non-coplanarity.
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