Process for the preparation of substrate surfaces for adhesive bonding

摘要

A process of preparing a substrate surface for a subsequent adhesive bonding, coating or pouring operation, by applying to the substrate an adhesion promoting composition comprising either: (A), (B) and (C); or (A) and (C); or (B) and (C); or (B) of the following ingredients (A)-(C): (A) 0.01 to 90 wt. % of optionally silanized material with a particle size <5 mu m and a hardness greater than that of the substrate surface, (B) 20 to 100 wt. % of silanized, silicon-containing material with an average particle size of 2 to 2100 mu m, (C) an abrasion agent with a particle size 5 mu m as the remainder; wherein the quantities quoted are relative to the total weight of (A)-(C). In the process the composition is applied to the substrate surface using horizontal or predominantly horizontal forces of friction, so that an adhesion promoting layer is formed on the substrate surface. The adhesion promoting composition may optionally contains either a bonding agent or an auxiliary agent, and in a preferred embodiment, the adhesion promoting composition is in the form of a grinding body and contains a bonding agent.