发明名称 Arrangement for coating substrates
摘要 The invention relates to an electrode configuration for a device for generating a plasma. RF is coupled contactlessly via a capacitive coupling electrode disposed at the dark space distance into a carrier backside of a coating installation. Dark space shields on the coating side define the plasma zone and prevent the formation of parasitic plasmas. HF substrate bias voltage on the moving substrate carrier is achieved with a defined plasma zone and the development of parasitic plasmas is avoided.
申请公布号 US5423971(A) 申请公布日期 1995.06.13
申请号 US19940179216 申请日期 1994.01.10
申请人 LEYBOLD AKTIENGESELLSCHAFT 发明人 ARNOLD, MANFRED;BLANG, GUIDO;GEGENWART, RAINER;MICHAEL, KLAUS;SCHERER, MICHAEL;RITTER, JOCHEN;BURKHARDT, OLIVER
分类号 C23C16/40;C23C16/50;C23C16/509;C23C16/54;H01J37/32;(IPC1-7):C23C14/34 主分类号 C23C16/40
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