发明名称 Twisted lead pairs on PCB to improve common mode rejection
摘要 The invention in its main aspect comprises a printed circuit board having a bus extending along a predetermined length of a portion of said printed circuit board, the bus having a predetermined width and defining a plurality of openings therein following a predetermined regular pattern, the pattern having at least a first pair of openings positioned on a first lateral side of an imaginary line along the bus, and at least a second pair of openings positioned on a second lateral side of the imaginary line along the bus, the first and the second pairs of openings being relatively arranged so that a first lead interconnecting the first pair of openings is in a twisted pair relationship with a second lead interconnecting the second pair of openings.
申请公布号 US5424490(A) 申请公布日期 1995.06.13
申请号 US19940202122 申请日期 1994.02.25
申请人 SONY ELECTRONICS INC. 发明人 DOMBROWSKI, JOSEPH J.;DAVIS, DONALD E.;GONZALEZ, ALBERTO M.;LOBB, KEVIN T.
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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