发明名称 THERMOSETTING RESIN COMPOSITION FOR IN-MOLD COAT MOLDING
摘要 PURPOSE:To obtain a thermosetting resin composition capable of forming a coating layer resistant to discoloration with time in a state immersed in hot water and useful as a substitute for metallic part, etc., by adding a specific amount of a specific antioxidant to a thermosetting resin composition containing a thermosetting resin and a copolymerizable monomer. CONSTITUTION:This composition is produced by incorporating (A) 100 pts.wt. of a thermosetting resin composed of a thermosetting resin such as urethane acrylate resin and unsaturated polyester resin and a copolymerizable monomer such as (alpha-methyl)styrene and divinylbenzene with (B) 0.05-2.5 pts.wt. of a phosphite-based antioxidant of formula (R1 and R2 are a 5-20C alkyl), e.g. 2,2-bis(4-didodecylphosphitephenyl)propane.
申请公布号 JPH07145267(A) 申请公布日期 1995.06.06
申请号 JP19930293165 申请日期 1993.11.24
申请人 SEKISUI CHEM CO LTD 发明人 TSUJI TOSHIMITSU;MORISHITA NATSUKI
分类号 B29C43/18;B29K105/06;B29L9/00;C08K5/52;C08K5/524;C08L101/00;(IPC1-7):C08K5/524 主分类号 B29C43/18
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