发明名称 THIN-FILM TRANSISTOR SUBSTRATE AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To provide a thin-film transistor substrate adaptable to high-density gate terminal arrangement and its manufacturing method. CONSTITUTION:This relates to a thin-film transistor substrate which is provided with a thin-film transistor of reverse-staggered structure in which a gate electrode 12, a gate insulating film 13, a semiconductor active film 14 and a source electrode 16 and a drain electrode 17 are formed in order on a substrate 11, a gate terminal 18 and a gate wiring 21 for transferring a scanning signal to a gate electrode, a source terminal 19 and a source wiring 22 for transferring a data signal to a source electrode. Therefore, the gate terminal is formed on the upper side of the gate insulating film and is electrically connected with the gate wiring through a contact hole 23 formed in the gate insulating film. Also, this is manufacturing method for a thin-film transistor substrate in which a conductive layer constituting the gate terminal is formed after the gate insulating film is formed.</p>
申请公布号 JPH07147410(A) 申请公布日期 1995.06.06
申请号 JP19930311365 申请日期 1993.11.16
申请人 ALPS ELECTRIC CO LTD 发明人 FUKUI HIROFUMI;SEKI HITOSHI;MIYAZAKI MASANORI;SASAKI MAKOTO;KASAMA YASUHIKO;OMI TADAHIRO
分类号 G02F1/136;G02F1/1362;G02F1/1368;H01L21/336;H01L21/77;H01L21/84;H01L29/78;H01L29/786;(IPC1-7):H01L29/786 主分类号 G02F1/136
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