Process for the metallization of nonconductive substrates with elimination of electroless metallization

摘要

A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising: (a) contacting the substrate with a suspension comprising a noble metal colloid suspended in a polymer matrix to obtain a coated substrate; (b) optionally removing at least part or substantially all of the polymer matrix from said coated substrate; (c) electrolytically coating the substrate obtained after step (a) or (b) with a solution of the principal metal coating. The polymer matrix is selected to combine with the metal of the noble metal coating or principal metal or both. Prior to contacting the substrate with the suspension, it may be contacted with a conditioner that will combine with the noble metal or principal metal or both to obtain a conditioned substrate. The conditioned substrate is then contacted with the suspension. A sufficient amount of the polymer matrix may be removed so that the residue of the polymer matrix will combine with the principal metal and the outer surface of the principal metal coating will be substantially free of the polymer matrix.