发明名称
摘要 PURPOSE:To integrate a support substrate and a reinforcing frame in a short time and with high accuracy by integrating the support frame and the reinforcing frame by the Au-Si eutectic junction. CONSTITUTION:An X-ray absorbing metal pattern is formed of Au, Ta, W, Pt, Mo, Re, TaN, WN and WTi, while an X-ray transmitting support film 2 consists of SiN, BN, SiC, Be and polyimide. A support frame 3 is constituted by a workable rigid body while usually consisting of single crystal silicon, and a reinforcing frame 7 is the rigid body while a quartz plate is used therefor. A junction part 8 of the support frame 3 and the reinforcing frame 7 is an Si-Au eutectic junction. Accordingly, the Au-Si eutectic junction is utilized for junction of the support substrate 3 and the reinforcing frame 7, while the silicon face of the support substrate 3 and the face having a metal layer of the reinforcing frame 7 are made to adhere closely and to oscillate by heating. Thereby, junction can be relatively simply and mechanically with high accuracy performed.
申请公布号 JPH0752711(B2) 申请公布日期 1995.06.05
申请号 JP19890072097 申请日期 1989.03.24
申请人 发明人
分类号 G03F1/22;G03F1/60;H01L21/027;H01L21/30 主分类号 G03F1/22
代理机构 代理人
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