发明名称 EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR
摘要 PURPOSE:To prevent bonding wires from contacting with other conductors such as other bonding wires, bonding posts, etc. CONSTITUTION:When bonding, the movement of wires 14a and 14b is prevented by means of wire supporters 15 which are located between the bonding points. Due to the wire supporters 15, the movement of the bonding wires 14a, 14b is prevented and thereby the hanging of the bonding wires the bonding wires 14a, 14b is prevented by the wire supporters 15, the loop control can be done easily and thereby the work can be done rapidly. Furthermore, as a margin between the bonding wires 14a and 14b can be reduced, the length of the wires can be shortened.
申请公布号 JPH07142523(A) 申请公布日期 1995.06.02
申请号 JP19930291582 申请日期 1993.11.22
申请人 HITACHI LTD 发明人 HIRAYAMA TAKESHI
分类号 H01L21/60 主分类号 H01L21/60
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