| 摘要 |
PURPOSE:To enable exposure of resist by exposure light of a short wavelength without using an excimer laser by making it unnecessary to synchronize output of an exposure light source and movement of a reticle and a wafer stage by using a continuous oscillation laser as an exposure light source. CONSTITUTION:The title semiconductor aligner is a scanning semiconductor aligner of reflection reduction type wherein a continuous oscillation laser 1 is used as a light source. The continuous oscillation laser 1 is provided with a laser light source 10 and a second harmonic wave generation device 20. The laser light source 10 is comprised of an LD excitation solid-state laser which projects second harmonic wave. Light projected from the laser light source 10 is injected to the second harmonic wave generation device 20. The second harmonic wave generation device 20 projects light (fourth or fifth harmonic wave) having a wavelength based on second harmonic wave of the injected light. Light projected from the second harmonic wave generation device 20 is cast on a reticle 40 and transfers a pattern formed in the reticle 40 to resist 44 formed on the wafer 45. |
