| 摘要 |
PURPOSE:To improve product yield and to improve throughput by controlling a temperature of a treatment object which is cooled after heated. CONSTITUTION:A supporter 14 which projects and detracts from the upper surface of a mounting stand 12 and supports a wafer W is provided to the mounting stand 12 as a cooling means whereon a heated wafer W is mounted, and a supply path 16 which is connected to a cooling water supply source 18 is also provided thereto. A temperature of the wafer W supported by the supporter 14 is detected by a temperature sensor 30 and a detected signal thereof is transmitted to a CPU 40. A rising/lowering cylinder 19 is contracted on the basis of a control signal from the CPU 40 and the supporter 14 is contained inside the mounting stand 12 to mount the wafer W on the mounting stand 12. Thereby, it is possible to cool the heated wafer W after made to stand by until it becomes a specified temperature and to prevent cracks, etc., due to rapid cooling of the wafer W. |
