INTEGRATED HEAT PIPE AND ELECTRONIC CIRCUIT ASSEMBLY AND METHOD FOR INTEGRATING THEM

摘要

PURPOSE: To reduce the total heat impedance by providing a heat wick which is adhered to a layer of high-purity copper and extends covering the layer nearly entirely and conducts working liquid in a heat-generating region of a multi-chip circuit module. CONSTITUTION: A multi-chip module substrate 22 receives a vaporizer/condenser unit 26 directly without an interposing interface. The heat wick 5a is fitted to the rear side of a heat pipe vaporizer 5. A wick substance 25 is fitted directly to a heat-generating body (multi-chip module 22). A heat grease interface that a heat-conducting medium contributes to is eliminated to significantly decrease the combined thermal impedance of a heat pipe and electric circuit module combination 20.