| 摘要 |
PURPOSE:To provide an integrated circuit package which can be easily manufactured high in accuracy and is hardly deformed even if an external force is applied to it. CONSTITUTION:An integrated circuit package is manufactured through such a manner that a resin bar 2 is provided near to the tips of outer leads 1 when the package is sealed up with resin, and a prescribed bar grooves 4 are provided to the base 3 of the package. The outer leads 1 are bent into nearly the shape of a letter C, and the resin bar 2 is filled into the bar groove 4. |
