| 摘要 |
PURPOSE:To reliably impart the function of a temperature fuse to a solder wire by a method wherein at least a part of a metal fine wire connecting an output electrode terminal to an outer led terminal is formed of solder wire, and balls provided to the ends of the solder wire are bonded to these terminals by pressure. CONSTITUTION:A metal fine wire 6 is connected between the tip of an outer lead terminal 4 of an emitter electrode and an emitter electrode terminal 3a of a circuit element of a semiconductor chip 3. On the other hand, a solder wire 7 functioning as a temperature fuse is connected between the tip of the outer lead terminal 5 of a collector electrode and the collector electrode 3b of the circuit element of the semiconductor chip 3. When a wire bonding operation is carried out with this solder wire 7', a ball 7a provided to the lower end of a material solder wire 7 inserted into a vertically movable capillary tool 21 is pressed against the collector electrode 3b of the semiconductor chip 3 to be crushed in the axial direction of the solder wire 7', deformed, and joined to the collector electrode 3b. |
