The hybrid circuit includes a temperature stabilized circuit mounted on a circuit carrier (20). A local region of the circuit carrier on which a module (22) to be heated and a heating element (28) are arranged is separated from the other regions by several elongated breakthroughs which surround the module and heating element in a ring-shape. Narrow bridges remain between adjacent breakthroughs. The module and heating element are connected with tracks (26) on the circuit carrier by wire bond connections. The tracks are outside the breakthroughs.
