Verfahren zur Montage von elektronischen Bauteilen auf einer Leiterplatte.

摘要

A method for mounting electronic parts on a printed circuit board by applying an adhesive to a printed board at predetermined positions is provided. A droplet of an acryl-modified resin emulsion adhesive in a predetermined volume is ejected from a nozzle to said board at each of said positions, the adhesive is dried to remove water therefrom to ensure mounting of said parts on said binder and a solder is applied to said adhesive areas. The advantage is that an exact amount of adhesive for retaining each part on the board is obtained by each single droplet and in addition the nozzle is non-contactive to the board.