发明名称 |
SEMICONDUCTOR APPARATUS AND PROCESS FOR MOUNTING THE SAME |
摘要 |
The semiconductor device is structured in a manner that a ball and a wire of a predetermined length are installed on a metal pad of a chip, and a polyimid tape is attached to the position of the substrate at which the chip is mounted, such that the wires of the chip are directly soldered with the circuit pattern of the substrate.
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申请公布号 |
KR950005494(B1) |
申请公布日期 |
1995.05.24 |
申请号 |
KR19910024130 |
申请日期 |
1991.12.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
OH, SE - HYOK;OH, DONG - YOL |
分类号 |
H05K1/18;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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