发明名称 Multiple wiring and X section printed circuit board technique
摘要 Multiple circuit functions embodied in electrical circuit lines and areas are supported by a multilayered printed circuit board of various lengths and widths (defining "x" and "y" directions) and of various thicknesses (defining a "z" direction) all on a single board. Several ways of achieving such variations in thickness include providing two layer subassemblies arranged in an alternate and intermediate manner, one subassembly being adapted to support electrical circuit lines and areas, and the other subassembly being formed of thin film dielectric material of various precalculated thicknesses. Another way of achieving a variation in thickness is to limit the surface covered by circuit lines with a pre-calculated core thickness.
申请公布号 US5418690(A) 申请公布日期 1995.05.23
申请号 US19940309554 申请日期 1994.09.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CONN, ROBERT B.;MAYO, DARLEEN;YOUNGS, JR., THURSTON B.
分类号 H05K1/00;H05K1/02;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/00
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