发明名称 METHOD FOR MANUFACTURING THICK-FILM ELECTRIC PART ON HYBRID CIRCUIT SUBSTRATE
摘要 PURPOSE: To form Ag/Pd conductors on a hybrid substrate. CONSTITUTION: (a) A substrate is coated with an Ag/Pd conductive paste. (b) In a burning process of the paste, oxygen is introduced to keep oxygen concentrations of 40% and more in the region, and the processed substrate is held at least for ten minutes at a temperature of 850 deg.C and more. And (c) the substrate is coated with an insulation layer, and the insulation layer is processed within the confines of the conditions described at (b).
申请公布号 JPH07135387(A) 申请公布日期 1995.05.23
申请号 JP19930282530 申请日期 1993.11.11
申请人 OSAKA OXYGEN IND LTD;BOC GROUP INC:THE 发明人 HAYASHI SHIGEKI;MAAKU JIEI KAASHIYUNAA;RUDORUFU URUFU;SATEISHIYU ESU TAMUHANKAA
分类号 H05K1/09;H01L23/12;H05K1/16;H05K3/12;H05K3/46;(IPC1-7):H05K3/12 主分类号 H05K1/09
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