| 发明名称 |
Flexible circuit board assembly with common heat spreader and method of manufacture. |
| 摘要 |
Disclosed are multi-layer substrates for flexible circuit boards and flexible circuit board assemblies and their methods of manufacture. More particularly multi-layer flexible circuit board substrates are described for attaching components including chips and heat spreaders to form a three-dimensional circuit board assembly. <IMAGE> |
| 申请公布号 |
EP0632685(A3) |
申请公布日期 |
1995.05.17 |
| 申请号 |
EP19940108592 |
申请日期 |
1994.06.01 |
| 申请人 |
IBM |
发明人 |
CUTTING LAWRENCE RICHARD;GAYNES MICHAEL ANTHONY;JOHNSON ERIC ARTHUR;MILKOVICH CYNTHIA SUSAN;PERKINS JEFFREY SCOTT;PIERSON MARK VINCENT;POETZINGER STEVEN EUGENE;ZALESINSKI JERZY |
| 分类号 |
H01L21/48;H01L23/367;H01L23/538;H05K1/00;H05K1/02;H05K1/18;H05K3/00;H05K3/12;H05K3/34;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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