| 摘要 |
Lead wires extending out from an electrical circuit device are removed from respective bonding pads to which they are bonded by a lateral shearing action. Shearing can be accomplished either unidirectionally, or with a bidirectional reciprocating movement. A shearing tool is provided with a single shearing projection for a unidirectional shearing, or with a pair of spaced shearing projections for bidirectional shearing. A vertical alignment is established between the tool and a first lead to be sheared, and this initial alignment is also used for shearing the other leads of the device. With the actual bond between a lead and its bonding pad occupying only a minor portion of the available surface area, a subsequent lead from a replacement device is bonded to the same bonding pad as the first lead by forming a new bond at a different site along the pad.
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