| 摘要 |
PURPOSE:To realize a multilayer printed-circuit board having high-density parts with good efficiency by a method wherein a first wiring board and a second wiring board provided with a plurality of connecting areas are laminated and integrated via an adhesive layer and connecting parts are connected by a welding operation. CONSTITUTION:A glass-epoxy-resin one-sided copper-clad laminated board 1 containing a plating catalyst is used, it is etched so as to remove only a copper foil which does not become a circuit, a circuit is formed, resists 3 are pasted on both faces of an insulating layer, through holes 4 are made drilling, only the inner wall of the through holes is plated 5, a plating resist is stripped, and a plated protrusion is formed. Then, an adhesive sheet 8 is piled up on the surface of a circuit board, the copper-clad laminated board provided with the through hole is overlapped in such a way that the surface of an insulating material is faced inward, a multilayer bonding operation is performed, the circuit board is placed on a copper plate 9, and every through hole in the laminated circuit board with the through holes and the copper plate are arc-welded and connected electrically. Consequently, a multilayer printed-circuit board with a circuit part of high wiring density can be realized with good efficiency. |
