| 摘要 |
PURPOSE:To provide a method of manufacturing a multilayer printed-wiring board, wherein the dislocation and the deformation of a hole for a contact hole are small and a fine wiring can be formed with good efficiency. CONSTITUTION:In the manufacture of a multilayer printed-wiring board, a metal foil 4 is pasted on one face of an insulating adhesive sheet 3, a hole 5 for a contact hole is then formed, one face on which the metal foil 4 is not pasted is brought into contact with a conductor wiring layer 2, the sheet is overlapped with a required position of the conductor wiring layer 2, the sheet is bonded and molded, and the metal foil 4 is then stripped. |
