发明名称 |
IN-MOLD TRANSFER MOLDING METHOD AND FORMING RETAINING MOLD |
摘要 |
PURPOSE:To form a boss or a pin by adapting an in-mold transfer molding method and a forming retaining mold and to enable the in-mold transfer to a surface having sudden unevenness. CONSTITUTION:A hole 17 is preliminarily provided to a transfer material 16 corresponding to the recessed part 14 of a retaining mold forming the protruding part of an injection molded product and the periphery of this hole is sucked from the suction port 15 of the retaining mold during injection and continuously fixed to the wall surface of a cavity to perform injection molding. |
申请公布号 |
JPH07117077(A) |
申请公布日期 |
1995.05.09 |
申请号 |
JP19930285880 |
申请日期 |
1993.10.20 |
申请人 |
RICOH CO LTD |
发明人 |
KOGA SHINJI |
分类号 |
B29C45/26;B29C45/14;B29C45/16;B29C45/36;B29L31/34;(IPC1-7):B29C45/16 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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