发明名称 |
Solder pad for printed circuit boards |
摘要 |
An improved omni-directional non-occluding solder pad design for printed circuit boards comprising a plurality of spokes radiating outward from a through-hole on the printed circuit board, with a ring concentric to the through-hole that intersects each of the plurality of spokes at approximately a perpendicular angle. The ringed-spoke configuration eliminates the need to ensure proper orientation of the solder pad on the printed circuit board prior to a wave soldering process since the symmetrical ringed-spoke design is omni-directional. The concentric ring structure provides an additional contact area of solder between the printed circuit board and a computer chassis. This additional contact area of solder ensures that there is a sufficient electrical connection between the printed circuit board and the computer chassis such that when the printed circuit board is mounted to the computer chassis, a proper grounding connection is provided.
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申请公布号 |
US5414223(A) |
申请公布日期 |
1995.05.09 |
申请号 |
US19940288470 |
申请日期 |
1994.08.10 |
申请人 |
AST RESEARCH, INC. |
发明人 |
SUSKI, EDWARD D.;SILVA, DAVID J.;MINER, GLENN G. |
分类号 |
H05K1/11;H05K3/32;H05K3/34;H05K3/42;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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