发明名称 METHOD AND APPARATUS FOR SPUTTERING MAGNETIC TARGET MATERIALS
摘要 A sputtering magnet assembly generates a magnetic field having sufficient strength to produce a plasma-confining magnetic tunnel over the front surface of a magnetic target. A magnetic shunt positioned a spaced distance from the back surface of the magnetic target provides an alternate path for excess magnetic flux liberated by erosion of the target. The alternate path provided by the magnetic shunt has a lower magnetic resistance than most paths that exit the front surface of the target, pass into the sputtering region, and re-enter the front surface of the target. Accordingly, most of the excess magnetic flux is prevented from escaping into the sputtering region.
申请公布号 WO9512003(A2) 申请公布日期 1995.05.04
申请号 WO1994US12070 申请日期 1994.10.21
申请人 MANLEY, BARRY, W. 发明人 MANLEY, BARRY, W.
分类号 H05H1/46;C23C14/35;H01J37/34;H01L21/203 主分类号 H05H1/46
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