| 摘要 |
A semiconductor device includes a lamination structure comprising a GaAs layer and an InGaAs layer (32b) grown on the GaAs layer, through which operating current flows in the thickness direction of the InGaAs layer. The InGaAs layer (32b) includes a plurality of very thin GaAs layers (1), through which most of the operating current passes due to tunnel effect, inserted into the InGaAs layer (23b) at prescribed intervals larger than a critical thickness that maintains a pseudomorphic state of an InGaAs crystal grown on a GaAs crystal. Therefore, segregation of In atoms, i.e., unfavorable move of In atoms in the growing InGaAs crystal toward the surface, which occurs remarkably when the InGaAs layer is grown at a high temperature, or elimination of In atoms can be suppressed by the very thin GaAs layers, so that the InGaAs layer can be grown on the GaAs layer at a high temperature without degrading the surface mohology of the InGaAs layer. As the result, an InGaAs layer with improved surface mohology, reduced contact resistivity and sheet resistivity, and improved uniformities of these resistivities in a wafer can be grown on the GaAs layer. <IMAGE> |
