LEAD FRAME AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To enhance a resin encapsulated semiconductor device in yield and reliability. CONSTITUTION:Cutouts 11A and 11B are provided to at least a part of a lead frame located near and outside its wire-bonding region 7 where inner leads 4A to 4E are bonded or to both the side faces of the inner leads 4A and 4E to form a flexible part 14 which can be easily bent by the resin pressure. A resin-encapsulated semiconductor device equipped with a lead frame provided with a flexible part 14 can be enhanced in yield and reliability.