| 摘要 |
PURPOSE:To provide a flip chip bonding method with which reliable and precise bonding can be conducted at a high yield rate by a rational operation. CONSTITUTION:The title flip chip bonding device is the device with which a semiconductor chip l and a chip mounting circuit substrate 4 are connected through the intermediary of a bump 3. The device is provided with a bonding tool 6 with which the chip 7 is fixed to the tip part, a bonding stage 7 with which the circuit substrate 4 is fixed, a pressure device 10 with which the bonding tool 6 is pressurized, devices 11 and 13 which give heating/cooling temperature profile control function and ultrasonic vibration function to the bonding tool 6 respectively, and devices 12 and 14 which give heating/cooling temperature profile control function and ultrasonic vibration function to the bonding stage 7. |
