发明名称 Dispersionsverstärkte Blei-Zinn-Legierung.
摘要 Addition of up to 5 vol. % of particles of intermetallics such as Ni3Sn4 and Cu9NiSn3 to a lead-tin alloy solder results into a dispersion strenghtened alloy having an improved strength and durability of the soldered joint obtained therefrom.
申请公布号 DE69108333(D1) 申请公布日期 1995.04.27
申请号 DE1991608333 申请日期 1991.08.20
申请人 PHILIPS ELECTRONICS N.V., EINDHOVEN, NL 发明人 BETRABET, HEMANT, NL-5656 AA EINDHOVEN, NL;BOSER, OTMAR, NL-5656 AA EINDHOVEN, NL;KANE, ROBERT, NL-5656 AA EINDHOVEN, NL;MCGEE, SUSAN, NL-5656 AA EINDHOVEN, NL;CAULFIELD, THOMAS, NL-5656 AA EINDHOVEN, NL
分类号 B23K35/26;C22C11/06;C22C13/00;C22C29/00;H05K3/34;(IPC1-7):B23K35/26 主分类号 B23K35/26
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