发明名称 IN-MOLD PLATING AND MOLDING
摘要 PURPOSE:To perform an effective process from molding of a metallized layer to the molding of a resin base by depositing a lower die member on a rotary table, then carrying out a sequence of steps such as polishing of the lower die member, forming of a metallized layer on the inner surface of a cavity, cleaning, drying and temperature raising, in a rotational manner, and binding the lower die member and an upper die member together to form a resin base. CONSTITUTION:A lower die member 1 is deposited on a rotary table 5 and an upper die member 2 is fixed to the die block of a molding machine for a molding and delivery device 13. At the circumferential bottom of the rotary table 5, a lower die member polishing device 10, a metal plating and cleaning device 11, a drying and temperature raising device 12 and a molding and delivery device 13 are sequentially arranged. Further, the surface of the lower die member 1 is polished and cleaned by the polishing device 10 and the metallized layer is formed on the inner surface of a cavity and a plating solution is cleaned from the surface by the metal plating and cleaning device 11. After that, the cleaning solution on the surface is dried and the temperature is raised by the drying and temperature raising device 12. Finally, resin is injected to form a single piece with the upper die member 2 by the molding and delivery device 13 to obtain a finished product 15 with a plated layer formed on the surface from the die.
申请公布号 JPH07108559(A) 申请公布日期 1995.04.25
申请号 JP19930254437 申请日期 1993.10.12
申请人 MITSUBISHI PLASTICS IND LTD 发明人 FUJITA OSAMU;NAGAMATSU KEIJI
分类号 B29C45/14;B29C45/00;B29C45/06;B29K105/22;B29L9/00;(IPC1-7):B29C45/14 主分类号 B29C45/14
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