发明名称 |
FLEXIBLE-RIGID MULTILAYERED BOARD AND ITS MANUFACTURE |
摘要 |
PURPOSE:To prevent the occurrence of characteristic impedance mismatching between hard board sections and a flexible section so that signals can be transmitted without loss by making the thickness of a signal circuit thinner in the flexible section than that in the hard board sections. CONSTITUTION:Two rigid board sections 1 which are rigid multilayered printed wiring boards are united in one body by using the flexible section 2 of a flexible printed wiring board. Both sections 1 and 2 are provided with sealed layers 3 as their outermost layers (both surfaces) and the layers 3 are isolated from an internal signal circuit 4 by interposing insulating layers between them. In addition, the sealed layers 3 of both sections 1 and 2 are connected to each other through a through hole 6. The signal circuit 4 is continuously formed from one hard board section 1 to the other hard board section 1 through the flexible section 2 and the width of the circuit 4 is not changed in the sections 1 and 2, but the thickness of the circuit 3 is made thinner in the flexible section 2 than that in the hard board sections 1. The insulating layers 5 between the layers 5 and circuit 5 are formed thicker in the hard board sections 1 and thinner in the flexible section 1. |
申请公布号 |
JPH07106766(A) |
申请公布日期 |
1995.04.21 |
申请号 |
JP19930275052 |
申请日期 |
1993.10.05 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
SUGIYAMA HIROYASU |
分类号 |
H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|