| 摘要 |
PURPOSE: To provide a semiconductor package with good possibility in assembling and good usability for various purposes, by forming a sealing region in and around a package board including an electronic micro-device, and providing a sealant between the package board and a cover after the cover is formed on the package board. CONSTITUTION: A sealing region is provided in and around a board 16 that includes an electronic micro-device and 22, and a sealant 14 with an activation temperature is applied between the board 16 and a cover 12. The board 16, the sealant 14, and the cover 12 are dipped in liquid at a temperature above the activation temperature of the sealant 14. Then, the sealant 14 is heated and held in the liquid for a time sufficient for the activation. The substrate 16, the cover 12 and the sealant 14 are taken out from the liquid 24, and then a sealed electronic micro-device package including the liquid 24 is obtained in a simple and easy step. |
