发明名称 Halbleiterlasermodul und Verfahren zum Zusammenbau des Halbleiterlasermoduls
摘要 In a semiconductor laser module, a semiconductor laser element is disposed on a side surface of a submount perpendicular to a front surface of a pedestal. The semiconductor laser element, the submount, a lens, and an optical fiber are positioned on the front surface of the pedestal so that laser light emitted from the semiconductor laser element is applied through the lens to a prescribed portion of the optical fiber with high reliability. Positioning of the laser element in the direction perpendicular to the front surface of the pedestal is facilitated, and positioning accuracy is improved, resulting in a low-cost and high-performance semiconductor laser module.
申请公布号 DE4436661(A1) 申请公布日期 1995.04.20
申请号 DE19944436661 申请日期 1994.10.13
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 TAKEMOTO, AKIRA, ITAMI, HYOGO, JP
分类号 G02B6/32;G02B6/42;H01S5/00;H01S5/02;H01S5/022 主分类号 G02B6/32
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