| 摘要 |
<p>The invention provides a method of depositing a patterned thin layer for repairing a wiring disconnection of a liquid crystal wiring substrate (12). The method includes the steps of positioning a medium (15) in the vicinity of or in contact with the disconnection of the substrate (12), and radiating a laser beam to the medium (15) so that a material produced by a thermal decomposition of the medium (15) is stuck to the disconnection to form a patterned thin layer for repairing the disconnection. Since the method does not need the steps of applying a medium to a substrate, heating a substrate, and washing a substrate after a modification has been completed, all of these steps are required in conventional methods, it takes only 30 seconds per a repairing, whereas the conventional methods took about 5 minutes. <IMAGE></p> |
