| 摘要 |
The application presents a method of treating chips with a chemical solution. In the method air is removed from the chips by using a vacuum, the vacuum-treated chips are put under a chemical solution pressure of no less than about 1 atm as quickly as possible after the chips come into contact with the solution, the solution is allowed to diffuse into the fibre walls at a temperature below the boiling temperature of the chemical solution and under atmospheric pressure, whereafter the temperature is raised to above 140 DEG C. |
